This is the basic hack for using the K62P mobile processor. The K62P has 128K of on-board cache, but no PowerNow. This hack will also work with a standard K62 2.2V BUT due to higher current draw and more finicky voltage requirements, you may not get to 400Mhz. K6clk.exe is not used for the non+ processors and will cause the system to hang if you try.
This works for the V3, V4 and V5 boards.
For V3 ONLY: add split voltage:
Remove R60 and R61 upper right side of CPU socket
Solder these 0 ohm resistors at R184 and R185 at lower right of CPU socket
Set up 2v core voltage:
Solder 10K 1/4 watt resistor across solder pads for R343 upper right of SODIMM socket . You might try slightly higher values for higher voltage, but I have not worked out the value for 2.2V. 2V works on a K62P. I do not know if it will work with a stock K62.
For V4/V5
Set SW4 to both open to set up 2V or 1 closed and 2 open for 2.2V
All Versions:
Add a .012 ohm SMT resistor on top of R302 to get max current from the power supply.
Set up for 100 Mhz FSB
Remove modem daughter board by removing 4 screws and removing board to gain access to the dip switch area. Be careful of the connector. This may be removed or left connected as long as care is taken not to damage it.
Tin the solder pads for SW2 at the upper right of where the modem board was.
Solder 4 position dip switch in place going 1234 left to right. Solder wick can be used to clean up the connection if solder bridges form. Set 123 to ON and 4 to OFF. Replace modem and connector if needed.
Set up CPU Multiplier:
Locate SW1 solder pads outboard the CPU socket.
Remove R130
Solder 4 position DIP switch in place.
1234 is top to bottom
1, 2, 3 closed 4 open is 450
1, 3 closed, 2, 4 open is 400
2, 3 closed, 1, 4 open is 250
2 closed, 1, 3, 4 open is 300
Add the cooling Resistor for Q16:
Put a .13 10 watt cooling resistor at the OUTPUT of Q16
De-solder pin 3 (the one closest to the sodimm), bend it up and soldered the resistor from it to the solder pad. I used some heat shrink tubing to insulate the leads and it is parallel to the memory socket and up near the RF shield to keep heat away from the board.
I am no longer suggesting the use of the copper heat sink soldered to the top of Q16. This can too easily end up shorting out. Consider limiting the speed to 400Mhz and using “rain” software for cooling.
The CPU requires fan cooling. Spot cooling of Q16 is suggested. Test voltages before putting in the CPU! The solder pad where pin 3 of Q16 was should be at 2.0 or 2.2V depending on what voltage you are using. The voltages can be check without the CPU.
I have all parts except heat shrink tubing at my website.
